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Ⅰ. Silicon Carbide (SiC) ke eng?
Silicon Carbide (SiC) ke motsoako oa semiconductor o entsoeng ka silicon (Si) le carbon (C). Ka sebopeho sa eona se hloekileng, ke ntho e thata haholo, e entsoeng ka kristale. SiC e ka ba teng ka mefuta e mengata e fapaneng ea kristale (e bitsoang polytypes, e kang 4H-SiC, 6H-SiC, 3C-SiC), e 'ngoe le e' ngoe e na le thepa e fapaneng hanyenyane. Bakeng sa lisebelisoa tsa ho roala, SiC hangata e sebelisoa e le filimi e tšesaane ho thepa ea substrate ho nka monyetla oa thepa ea eona e lakatsehang.
Ho roala ha SiC ke lera la silicon carbide e behiloeng holim'a thepa e 'ngoe. Liaparo tsena li etselitsoe ho sireletsa karolo e ka tlase ho tikoloho e thata, ho ntlafatsa ts'ebetso ea eona, kapa ho lelefatsa bophelo ba eona ba ts'ebeletso. Liaparo tsa SiC li kenngoa ho sebelisoa mekhoa e fapaneng, ho kenyelletsa le chemical vapor deposition (CVD), physical vapor deposition (PVD), le plasma spraying. Khetho ea mokhoa o itšetlehile ka botenya bo lakatsehang ba ho roala, ho tšoana le thepa ea substrate.
TŠEBELETSO EA KHRESTE EA CVD SIC FILM
Ⅱ. Thepa ea 'mele ea Silicon Carbide SiC
SiC e na le mefuta e mengata e khahlang ea thepa ea 'mele e e etsang hore e tšoanelehe bakeng sa lits'ebetso tse fapaneng tse hlokang, haholo joalo ka thepa ea ho roala.
| Lintho tsa motheo tsa 'mele tsa CVD SiC coating | |
| Property | Boleng bo tloaelehileng |
| Sebopeho sa Crystal | FCC β phase polycrystalline, haholo-holo (111) e sekametseng |
| segokanyipalo | 3.21 g, / cm³ |
| thatafala | 2500 Vickers boima (moroalo oa 500g) |
| Boholo ba lijo-thollo | 2 ~ 10μm |
| K'hemik'hale e Hloekileng | 99.99995% |
| Mocheso bokgoni | 640 J·kg-1·K-1 |
| Sublimation Mocheso | 2700 ° C |
| Matla a Flexural | 415 MPa RT 4-ntlha |
| Modulus e monyane | 430 Gpa 4pt kobeha, 1300 ℃ |
| Thermal Conductivity | 300W·m-1·K-1 |
| Katoloso ea Thermal(CTE) | 4.5 × 10-6K-1 |
Lintho tsena, haholo-holo ho thatafala ha eona, botsitso ba mocheso o phahameng, le ho se sebetse ha lik'hemik'hale, li etsa hore SiC e be khetho e nepahetseng bakeng sa ho sebelisoa e le tšireletso libakeng tse thata tsa indasteri.
Ⅲ. Li-substrates tse sebelisoang hangata bakeng sa ho roala SiC?
Liaparo tsa Silicon carbide (SiC) li sebelisoa haholo libakeng tse fapaneng tsa indasteri ka lebaka la thepa ea tsona e ntle ea 'mele le ea lik'hemik'hale, haholo indastering ea semiconductor, e nang le litlhoko tse thata mabapi le ts'ebetso ea thepa. Ho khetha thepa e nepahetseng ea substrate ho bohlokoa ho netefatsa ts'ebetso le ho tšoarella ha Liaparo tsa SiC. Tse latelang ke tse ling tsa li-substrates tse sebelisoang hangata bakeng sa liphahlo tsa SiC:
1. Graphite:
Lebaka: Graphite ke substrate e tloaelehileng haholo bakeng sa Liaparo tsa SiC, haholo-holo likarolong tse ling tsa lisebelisoa tsa mocheso o phahameng le indasteri ea semiconductor (e kang lihitara, liketsoana le li-susceptors). Graphite e na le botsitso bo botle ba mocheso o phahameng le conductivity, 'me e batla e tsamaisana le coefficient of thermal expansion (CTE) ea SiC, e thusang ho fokotsa khatello ea mocheso. Holim'a moo, Liaparo tsa SiC e ka ntlafatsa haholo khanyetso ea oxidation, ho hanyetsa kutu, le ho roala ho hanyetsa ha likarolo tsa graphite, le ho fokotsa tlhahiso ea likaroloana.
Libaka tsa kopo: Likarolo tsa lisebelisoa tsa semiconductor (li-susceptors tsa MOCVD, likarolo tsa sebōpi sa epitaxial), likarolo tsa sebōpi se nang le mocheso o phahameng oa mocheso, li-nozzles tsa rocket, joalo-joalo.
2. Lisebelisuoa tsa Ceramic (Ceramics):
Alumina (Al₂O₃): Ha e bapisoa le litšenyehelo tse tlase, ho kenya letsoho hantle le matla a itseng a mochini. Ho roala ha SiC ho ka matlafatsa khanyetso ea eona ea ho roala le ho hanyetsa ho bola ha lik'hemik'hale.
Silicon Nitride (Si₃N₄): Matla a phahameng, boima bo phahameng le khanyetso e ntle ea mocheso oa mocheso. Ho roala ha SiC ho ka ntlafatsa le ho feta ho thatafala ha eona holimo le botsitso ba lik'hemik'hale.
Li-ceramics tse ling: Tse kang Mullite, Boron Carbide, joalo-joalo, tse khethiloeng ho latela litlhoko tse khethehileng tsa kopo. Lits'ebetsong tsa semiconductor, li-substrates tsa ceramic tse hloekileng haholo li khethoa ho qoba tšilafalo.
3. Silicone (Silicon, Si):
Lebaka: Ka indasteri ea semiconductor, ho tloaelehile ho beha liphahlo tsa SiC ka ho toba holim'a liphaphatha tsa silicon kapa likarolo tsa silicon. Sena se ka fana ka tšireletso khahlanong le khoholeho ea plasma kapa e le karolo ea sebopeho se itseng sa sesebelisoa sa elektroniki. Ho lumellana ha lik'hemik'hale pakeng tsa tse peli ho molemo.
Libaka tsa kopo: likarolo tsa ts'ebetso ea semiconductor wafer, lisebelisoa tsa MEMS.
4. Litšepe le Alloys:
Mabaka: Likarolo tse ling tsa tšepe li hloka ho ntlafatsa khanyetso ea ho roala, ho hanyetsa kutu kapa ho hanyetsa mocheso o phahameng libakeng tse itseng. Leha ho le joalo, phapang ea coefficient ea ho atolosa mocheso pakeng tsa tšepe le SiC hangata e kholo, e ka bakang mathata a ho khomarela kapa ea hlahisa khatello ea kelello nakong ea libaesekele tse futhumetseng. Ka hona, hangata ho hlokahala lera la phetoho e mahareng kapa mokhoa o khethehileng oa deposition.
Li-substrates tse tloaelehileng tsa tšepe:
● Stainless Steel: E sebelisoa maemong ao ho ona ho hanyetsanang le kutu le ho hanyetsa ho itseng ho hlokahalang.
● Molybdenum le li-alloys tsa eona: E sebelisoa lits'ebetsong tsa mocheso o phahameng ka lebaka la sebaka se phahameng sa ho qhibiliha le ho tšoana hantle le CTE.
● Tungsten le li-alloys tsa eona: E boetse e sebelisoa libakeng tse phahameng tsa mocheso.
Libaka tsa kopo: Likarolo tsa lisebelisoa tsa lik'hemik'hale, likarolo tsa sebopeho sa mocheso o phahameng, likarolo tse sa senyeheng.
5. Bulk SiC:
Lebaka: Ka linako tse ling, mofuta o itseng oa Ho roala ha SiC (mohlala, polytype e fapaneng kapa SiC ea bohloeki bo phahameng) e behiloe holim'a substrate e ngata ea SiC e le ho ntlafatsa ka ho eketsehileng litšobotsi tsa holim'a karolo e teng ea SiC (mohlala, ho eketsa bohloeki, ho fetola topography, kapa ho lokisa liphoso tsa holim'a metsi).
Likopo: Likarolo tse phahameng tsa SiC tse hloekileng ho lisebelisoa tsa semiconductor (mohlala, phetoho ea holim'a mehele ea SiC, liketsoana tsa SiC).
Lintlha tsa bohlokoa tse lokelang ho nahanoa ha u khetha thepa ea substrate:
● Coefficient of thermal expansion (CTE) e bapisang: Ho bapisa CTE pakeng tsa substrate le ho roala ho bohlokoa ho fokotsa khatello ea mocheso le ho thibela ho phunyeha le ho senya, haholo-holo tlas'a maemo a nang le liphetoho tsa mocheso.
● Tšebelisano ea lik'hemik'hale: Thepa ea substrate ha ea lokela ho itšoara hampe leHo roala ha SiCkapa tikoloho ya tshebetso.
● Ho khomarela: Lesela la SiC le tlameha ho khona ho khomarela ka matla ho substrate. Phekolo ea holim'a substrate (bohloeki, bohloeki) e na le tšusumetso e kholo ho khomarela.
● Mocheso oa ho sebetsa: Thepa ea substrate e tlameha ho khona ho mamella mocheso oa mokhoa oa ho beha litlolo tsa SiC hammoho le mocheso oa tikoloho ea kopo ea ho qetela.
● Lisebelisoa tsa mechine: Substrate e lokela ho ba le matla a lekaneng le ho tiea ho tšehetsa ho roala le ho mamella meroalo ea ts'ebetso.
● Katleho ea litšenyehelo: Litsenyehelo tsa thepa ea substrate le tsona ke taba ea bohlokoa e sebetsang.
Ⅳ. Meeli ea Liaparo tsa SiC ho Semiconductor Processing
Leha ho na le melemo e mengata ea liphahlo tsa SiC, ho boetse ho na le meeli lits'ebetsong tsa semiconductor:
1. Litšenyehelo: Lisebelisoa tse tala tse phahameng tsa SiC le lisebelisoa tse khethehileng le mekhoa e hlokahalang bakeng sa ho behoa (haholo-holo CVD SiC ea boleng bo phahameng) e ka etsa hore liaparo tsa SiC li theko e boima ho feta mekhoa e meng ea setso. Sena e ka ba tšitiso bakeng sa lits'ebetso kapa likarolo tse ling tse sa tsotelleng litšenyehelo.
2. Brittleness: Joaloka lirafshoa tse ngata, SiC e brittle ka tlhaho. Le hoja e le thata haholo, e atisa ho phunya kapa ho phunyeha tlas'a ts'oaetso ea mochine kapa khatello e phahameng ea khatello ea kelello. Sena se hloka moralo o hlokolosi le ts'ebetso ea likarolo tse koahetsoeng tsa SiC.
3. Coefficient of Thermal Expansion (CTE) Mismatch: Le hoja CTE ea SiC e batla e tsitsitse, ho se lumellane hoa bohlokoa le CTE ea thepa ea substrate ho ka lebisa khatellong e phahameng ea ka hare nakong ea libaesekele tsa mocheso (ho futhumatsa le ho pholile). Sena se ka baka ho phatloha, delamination, kapa deformation ea lera kapa substrate. Khetho e hlokolosi ea thepa le moralo lia hlokahala ho fokotsa sena.
Mathata a Deposition:
1. Uniformity ho Complex Geometries: Ho finyella liphahlo tsa SiC tse ts'oanang ka ho phethahetseng holim'a likarolo tse kholo kapa tse rarahaneng tse nang le sebōpeho ho ka ba phephetso 'me ho ka hloka mekhoa e rarahaneng ea ho beha le ho laola ts'ebetso.
2. Ho khomarela: Ho etsa bonnete ba ho khomarela ka matla pakeng tsa ho roala ha SiC le thepa ea substrate ke ea bohlokoa bakeng sa ts'ebetso le bophelo bohle ba ho roala. Ho lokisoa ha bokaholimo ba substrate ho bohlokoa.
3. Khatello ea Khatello ea Liaparo tse Thick: Ha botenya ba ho roala bo ntse bo eketseha, khatello ea ka hare e ka bokellana, e leng se ka lebisang ho phunyeha kapa ho senya.
4. Ts'ebetso ea ts'ebetso: Ka lebaka la boima ba eona bo feteletseng, ho sebetsa kapa ho fetola liphahlo tsa SiC (kapa boholo ba SiC) ka mor'a hore ho behoe ho thata ebile ho theko e boima, ka tloaelo ho hloka lisebelisoa tsa daemane kapa mekhoa ea laser ablation. Sena se bolela hore likaroloana hangata li hloka ho etsoa hore li be le sebopeho se haufi-ufi pele li koahetsoe.
5. Taolo ea Bofokoli: Ho finyella likhaello tse fokolang haholo (mohlala, li-pinholes, mapetsong, li-inclusions) ho li-coatings tsa SiC, haholo-holo lits'ebetsong tse mahlonoko, ho hloka taolo e thata ea ts'ebetso le li-precursors tse phahameng tsa bohloeki. Mefokolo ena e ka sekisetsa thepa ea tšireletso ea ho roala.
Ho sebetsana le mefokolo ena hangata ho kenyelletsa R&D e tsoelang pele ho mahlale a mahlale a SiC, mekhoa ea ho bea, le moralo oa likarolo ho ntlafatsa ts'ebetso le katleho ea lipehelo tsa SiC indastering e tsoelang pele ea semiconductor.
Ⅴ. Hobaneng u khetha Semixlab?
E thehiloe ka 2018, Semixlab Technology Co., Ltd ke khoebo e thehiloeng ho theknoloji e shebaneng le lipatlisiso le nts'etsopele, tlhahiso le thekiso ea thepa e tsoetseng pele. Ke moetsi ea etelletseng pele lefatšeng ka bophara oa semiconductor.
Semixlab e shebane le lipatlisiso le nts'etsopele le tlhahiso e kholo ea mahlale a tsoetseng pele indastering ea semiconductor, joalo ka CVD silicon carbide coatings, CVD tantalum carbide coatings, CVD Solid SiC, lisebelisoa tse phahameng tsa CVD SiC, le lisebelisoa tse tsoetseng pele tsa ho paka. Semixlab e ikemiselitse ho fana ka tharollo ea theknoloji e ka khonehang le lihlahisoa bakeng sa indasteri ea ho roala ka semiconductor. Haeba u tobane le mathata leha e le afe a sehlahisoa / botekgeniki tšimong ea sic coating ac coating, u amohelehile ho buisana le rona.
Semixlab Technology Co.,Ltd, e thehiloeng ka 2018, ke kgwebo e thehilweng theknolojing e shebaneng le dipatlisiso le ntshetsopele, tlhahiso le thekiso ya thepa e tswetseng pele. Ke moetsi ya etellang pele lefatsheng wa thepa ya semiconductor.
