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Masale a Focus a CVD a Tiileng a SiC
Masale a tsepamisang maikutlo a Semixlab a CVD a tiileng a entsoe bakeng sa tikoloho e tsoetseng pele ea ho betla ka plasma, a fana ka botsitso bo ikhethang ba plasma, tšilafalo e tlase haholo, le bophelo bo bolelele ba ts'ebeletso. A entsoe ka ho sebelisa silicon carbide ea chemical vapor deposition (CVD) e nang le density e phahameng, masale ana a tsepamisang maikutlo a fana ka khanyetso e phahameng khahlanong le khoholeho ea plasma le tlhaselo ea lik'hemik'hale, e leng se etsang hore a be a loketseng lits'ebetso tsa bohlokoa tsa ho betla ka har'a tlhahiso ea semiconductor. Re labalabela ho fumana lipotso tsa hau tse ling.
Tlhaloso
Ho Enjene Bokamoso ba Sub-7nm Etch E hlahisa 99.99999% Bohloeki bo Phahameng ka ho Fetisisa | Ho Etching e Tsitsitseng ea HAR | Mokhoa o Molemo oa ho Eketsa Mehele ea Silicon
Nakong ea li-transistors tsa 3D NAND le GAA tse fetang 300, lintho tse sebelisoang tsa setso ke sesosa se seholo sa mathata a tlhahiso. Masale a focus a Semixlab a CVD a tiileng a SiC a etselitsoe ho sebetsana le plasma e nang le density e phahameng e hlokahalang bakeng sa ho betla ha karolo e phahameng (HAR). A theha tikoloho e tsitsitseng, e se nang likaroloana tseo masale a tloaelehileng a silicon (Si) a ke keng a li fana.
Tekanyetso ea Indasteri: Hobaneng e Etella Pele Phetoho ea Fabs ho ea ho Solid SiC
7-Nines (99.99999%) Tšepe e Hloekileng: Ka ho sebelisa mokhoa oa rona oa ho tlosa mouoane o tsoetseng pele oa lik'hemik'hale, re fihlela litšila tsohle tsa tšepe < 0.1 ppm. Sena se bapala karolo ea bohlokoa ho qobeng likoli tse amanang le tjhaja le tšilafalo ea tšepe e boima ho logic e tsoetseng pele le li-memory chips.
Taolo ea Precision Edge Roll-off (ERO): Masale a rona a tiileng a SiC a boloka khanyetso e tsitsitseng ea motlakase le phallo e phahameng ea mocheso (≥ 150 W/m·K). Sena se etsa sheath ea plasma e tšoanang moeling oa wafer.
Sena se rarolla mathata a Edge Roll-off ka kotloloho a bakang ho tšoana ha wafer ea lisenthimithara tse 12.
Ho Hanela Khoholeho ea Moroallo bakeng sa ho Etching ha HAR: Ho plasma e nang le Fluorine e nang le matla a mangata (CF4/CHF3) le Chlorine e nang le Chlorine (Cl2), Solid SiC e bontša sekhahla sa khoholeho ea moroallo ka 80% ho feta Silicon e le 'ngoe ea kristale. Sena se atolosa nako ea PM (Preventative Maintenance), e leng se fokotsang haholo Litšenyehelo tsohle tsa Bong (CoO).
Botšepehi ba "Solid" ba Monolithic: Ho fapana le Graphite e koahetsoeng ke SiC, likarolo tsa rona li teteaneng ka 100% SiC e ngata. Sena se felisa kotsi ea ho petsoha ha Micro-cracking kapa Coating Delamination, e thibelang Tšilafalo e mpe ea Likaroloana nakong ea lipotoloho tsa etch tse matla haholo.
E ntlafalitsoe bakeng sa Li-platform tsa Next-Gen Etch
Setsi sa rona sa tlhahiso se sebelisa CNC e lebelo le phahameng ea 5-axis le Metrology ea Laser ho netefatsa hore e lumellana ka 100% le litlhaloso tsa OEM bakeng sa:
● Ho qolla Mokhanni: Ho qolla Poly-Si le ho qolla Silicide.
● Etch ea Dielectric: Ho kopana le ho phunya ha trench ka tekanyo e phahameng (HAR).
● Ho lumellana: Ho nkela sebaka sa Lam Research (Kiyo/Versys), Applied Materials (Centris), le li-platform tsa TEL (Tactras/Vigus).
songolo
| Tekano ea Teknete | Semixlab CVD Solid SiC | Letšoao la Indasteri (Si) | Tlhōlisano Edge |
| K'hemik'hale e Hloekileng | 99.99999% (7N) | 99.999% (5N) | E felisa ho dutla ha ion |
| Mokhahlelo oa Mokhahlelo | 100% β-SiC (Dikhubu) | Kristale e le 'Ngoe Si | Khanyetso ea Isotropic etch |
| Boikarabello bo amanang | ≥99.8% (3.20 g/cm3) | N / A | Sebopeho sa lefela-masoba |
| Vickers Hardness | 28 - 30 GPA | ~9 GPA | E hanela ho phatloha ha li-ion |
| Bokhopo bo Holimo | Ra <0.2 μm | Ra ~0.5μm | Ho khomarela ha polymer e nyane haholo |
dikopo
Maemo a Konokono a Kopo
Moo ho hlokahalang bohloeki bo feteletseng le ho mamella plasma, CVD Solid SiC ea rona e eme e le tekanyetso ea indasteri:
● Ho eketsa 3D NAND le DRAM: E etselitsoe liphephetso tsa ho fata ka HAR (High Aspect Ratio). E fana ka botsitso bo hlokahalang ho fata ka har'a mekhahlelo e fetang 300 ntle le ho sotha profil.
● Li-Node tsa Logic tsa Sub-7nm: Haholo-holo bakeng sa meralo ea FinFET le GAA. Re thusa masela ho felisa tšilafalo ea tšepe e nyenyane, re sireletsa lerako le bonolo la li-transistors tsa moloko o latelang.
● Setsi sa Semiconductor sa Matla: Ebang ke SiC epitaxy kapa deep trench etching bakeng sa GaN, dikarolo tsa rona di sebetsana le meroalo e phahameng ya mocheso wa tlhahiso ya sekgeo se seholo.
● TSV le Sephutheloana se Tsoetseng Pele: E ntlafalitsoe bakeng sa lits'ebetso tsa Through-Silicon Via, ho netefatsa hore ho boreleli leboteng le otlolohileng hoa hlokahala bakeng sa kopanyo ea 2.5D/3D.
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