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CMP polishing abrasive
| Sebaka sa Tšimoloho: | China |
| Name Brand: | Semixlab |
| Number Model: | SXL-1 |
| tiiseletswe: | ISO14001, ISO45001, ISO9001 |
| Ntho e nyenyane ea litaelo: | Taba ea lipuisano |
| Price: | Ikopanye bakeng sa Khotheishene e Itlhophileng |
| Lintlha tsa ho Packa: | Sephutheloana se tloaelehileng sa kantle ho naha |
| Nako ea thomello: | Matsatsi a 15-30 Ka mor'a Tiisetso ea Taelo |
| Terms tefello: | T / T |
| Phepelo Matla: | 10 tons/Kgwedi |
Tlhaloso
CMP (Chemical Mechanical Planarization) polishing abrasive ke lisebelisoa tsa bohlokoa masimong a tlhahiso ea semiconductor, likhalase tsa optical, li-circuits tse kopaneng, joalo-joalo, le ho fihlela nano-level surface flattening ka phello ea synergistic ea ho bola ha lik'hemik'hale le ho sila ka mochini.
e sebetsa joang:
Li-abrasives tsa CMP ke lisebelisoa tsa bohlokoa lefapheng la tlhahiso ea potoloho e kopaneng 'me li ka sebelisoa ho ILD ea potoloho e kopaneng, li-silicone tsa semiconductor monocrystalline, semiconductor silicon carbide, li-integrated circuit shallow trench isolation (STI), potoloho e kopantsoeng ea polysilicon (Poly-Si), litšepe tse kopantsoeng tsa potoloho le likarolo tse thibelang tšepe.
Litšebeletso li ka fanoa:
tlhahlobo ea boemo ba ts'ebeliso ea bareki, lisebelisoa tse tsamaellanang, ho rarolla mathata a tekheniki.
Boemo ba Khoebo:
Semixlab e na le lilaboratori tse 2, sehlopha sa litsebi tse nang le boiphihlelo ba lilemo tse 20, tse nang le R&D le tlhahiso, bokhoni ba tlhahlobo le netefatso.
songolo
Lipontšo tsa Ts'ebetso bakeng sa Lihlahisoa tsa Ultra-High Purity Series
| paramethara | SXL-1 | SXL-2 | SXL-3 | SXL-4 | SXL-5 | SXL-6 | SXL-7 |
| Karolelano ea SilicaParticle Size/nm | 35 ± 5 | 45 ± 5 | 65 ± 5 | 75 ± 5 | 85 ± 5 | 100 ± 5 | 120 ± 5 |
| Nanoparticle SizeDistribution (PDI) | |||||||
| Tharollo pH | 7.2-7.4 | 7.2-7.4 | 7.2-7.4 | 7.2-7.4 | 7.2-7.4 | 7.2-7.4 | 7.2-7.4 |
| Litaba tse tiileng/% | 20.5 ± 0.5 | 20.5 ± 0.5 | 20.5 ± 0.5 | 20.5 ± 0.5 | 20.5 ± 0.5 | 20.5 ± 0.5 | 20.5 ± 0.5 |
| Ponahalo | Blue Light | Blue | White | E isang bosoeung | E isang bosoeung | E isang bosoeung | E isang bosoeung |
| Particle Morphology X | X:S-pherical;B- Curved;P- Sebōpeho sa Peanut;T- Bulbous;C- Ketane-joaloka (boemo bo kopaneng) | ||||||
| Ho tsitsisa Ions | Li-amine tsa Organic/Inorganic | ||||||
| Sebopeho sa Raw material Y | Y:M-TMOS;E-TEOS;ME-TMOS+TEOS;EM-TEOS+TMOS | ||||||
| Lintho tse Hloahloa tsa Metal | ≤300ppb | ||||||
dikopo
Libaka tsa kopo tse ka sehloohong
| Tataiso ea kopo | Boemo bo tloaelehileng |
| Tlhahiso ea Semiconductor | Li-Chips tsa Potoloho e Kopanetsoeng (IC) le Lisebelisoa tsa Semiconductor tsa Moloko oa Boraro |
| Theknoloji ea Optics le Pontšo | Khalase ea optical, lense le phanele ea ponts'o |
| Lisebelisoa tsa polokelo | Li-platter tsa hard disk le memori ea 3D NAND flash |
| Packaging e tsoetseng pele | Sephutheloana sa Wafer-level (WLP), TSV (ka silicon ka) |
| Lisebelisoa tse ling tsa maemo a holimo | MEMS (Micro-Electro-Mechanical Systems) le Li-implants tsa Bongaka |
Ecological chain netefatso
Semixlab CMP polishing abrasives e kopana le setifikeiti sa indasteri ea semiconductor mme e fetile setifikeiti sa ISO 14001/45001/9001.
Mokhoa o tloaelehileng oa kopo
Lintho tse tala → Abrasive Synthesis (Phetoho ea bokaholimo)→ Sebopeho sa Slurry (Tlhaloso/Phetoho ea PH)→ Ho belisoa ha CMP (taolo ea EPD)→ Hloekileng Ka mor'a → Tlhahlobo (AFM/KLA)→ Katoloso ea Maikutlo a Lintlha
Ka ts'ebetso ea ts'ebetso ea ts'ebetso ea ts'ebetso, Semixlab CMP polishing abrasive e fihletse tsoelo-pele tšimong ea potoloho e kopantsoeng ea semiconductor e phahameng, butle-butle e nketse thepa e tsoang linaheng tse ling 'marakeng oa semiconductor,' me e sebelisitsoe ka katleho tlhahiso le tlhahiso ea LCD, OLED le likarolo tse ling tsa pontšo. Haeba o hloka ho fumana lintlha tse qaqileng tsa lipampiri tse tšoeu tsa tekheniki kapa ho hlophisa tlhahlobo ea sampole, ka kopo ikopanye le sehlopha sa rona sa tšehetso ea tekheniki.
Molemo oa Khatello
Semixlab CMP e bentša melemo ea mantlha ea abrasive
a.Ka bolokolohi fetolehang particle bophara le tekanyo ea phatsa aggregation;
Likaroloana tsa b.Monodisperse tse nang le kabo ea boholo ba likaroloana tse ts'oanang;
c.Stable dispersion system;
d.Bokhoni bo boholo ba tlhahiso e nang le phapang e fokolang ea batch-to-batch;
e.E tsitsitseng haholo, e hanyetsanang le agglomeration le sedimentation.
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Lebenkele la Lihlahisoa tsa Semixlab
Semixlab CMP e bentša mabenkele a li-abrasive
