PSPI photosensitive polyimide photoresist

Semixlab PSPI sephutheloana sa li-photosensitive polyimide

PSPI ke sesebelisoa sa resin se nang le li-photosensitive bakeng sa baetsi ba semiconductor. E fana ka mesebetsi ea bohlokoa haholo tlhahisong ea semiconductor, e sebetsa joalo ka filimi e sireletsang holim'a lintho tsa semiconductor, lesela la passivation bakeng sa maqhubu, le lesela le sireletsang bakeng sa ho kopanya hape.

Thepa ena e ikhetha ka lebaka la litšobotsi tsa eona tse ikhethang. E fana ka matla a ho futhumatsa hantle le a ho hanyetsa lik'hemik'hale. Ho feta moo, e na le thepa e makatsang ea motlakase le mochini.

Ho fihlela litlhoko tse ntseng li tsoela pele tsa indasteri, re thehile li-productfolio tse fapaneng. Lihlahisoa tsena li hlomeletsoe hantle ho phethahatsa litlhoko tsa theknoloji ea ho paka ea moloko o latelang, ho netefatsa hore re ka fana ka litharollo tse tsamaisanang le tsoelo-pele ea morao-rao lefapheng la semiconductor.

Sesebelisoa:

E sebelisoa haholo-holo tšimong ea semiconductor, bakeng sa filimi e sireletsang holim'a likarolo tsa semiconductor, lera le phahamisitsoeng la passivation, lera la ho kenya letsoho hape joalo-joalo. E boetse e sebelisoa ka ho eketsehileng ho liphutheloana tse khahlehang tse hlokang ho etsoa ka mekhahlelo e mengata.

Litšebeletso li ka fanoa:

tlhahlobo ea boemo ba ts'ebeliso ea bareki, lisebelisoa tse tsamaellanang, ho rarolla mathata a tekheniki.

Boemo ba Khoebo:

Semixlab e na le lilaboratori tse 2, sehlopha sa litsebi tse nang le boiphihlelo ba lilemo tse 20, tse nang le R&D le tlhahiso, bokhoni ba tlhahlobo le netefatso.

Boitsebiso bo potlakileng:

1. Mabitso a fapaneng bakeng sa lihlahisoa:PSPI photosensitive polyimide photoresist/PSPI/Photosensitive insulating/PSPI photosensitive polyimide packaging material/Photosensitive Polyimide.

2. Kopo e ka Sehloohong: E ​​sebelisoa haholo-holo lebaleng la semiconductor, bakeng sa filimi e sireletsang holim'a likarolo tsa semiconductor, lesela le phahamisitsoeng la passivation, lera la ho kenya letsoho hape joalo-joalo. E boetse e sebelisoa ka ho eketsehileng ho liphutheloana tsa ho itšehla thajana tse hlokang ho etsoa ha lihlopha tse ngata.Haholo-holo tšimong ea liphutheloana tsa Semiconductor tse mahareng le tse phahameng.

3. Litlhaloso tsa mantlha:

Photosensitive qeto ≤3um, mogote botsitso ho fihlela ho 320 ℃, dielectric kamehla 3.3 (1MHz), adhesion 40Mpa, acid e matla le alkali kutu ho hanyetsa, moqotetsane tshebetso fensetere, haholo-holo tšimong ea ambalaji mahareng le phahameng.

Tafole ea papiso ea tšebetso ea sehlahisoa:

Mokhoa o tloaelehileng oa kopo

Ka boqapi ba sebopeho sa limolek'hule le ntlafatso ea liparamente tsa ts'ebetso, Semixlab PSPI e fihletse tsoelo-pele ea thepa ea ho paka ea boleng bo holimo, e fana ka tiisetso e tšepahalang ea ho paka bakeng sa masimo a tsoetseng pele joalo ka li-module tsa 5G RF, li-module tsa motlakase tsa maemo a likoloi le li-chip tsa AI. Haeba o hloka ho fumana lintlha tse qaqileng tsa lipampiri tse tšoeu tsa tekheniki kapa ho hlophisa tlhahlobo ea sampole, ka kopo ikopanye le sehlopha sa rona sa tšehetso ea tekheniki.

Semixlab PSPI Core Melemo

1. Ultra-high-precision lithography

3μm resolution ho fihlela litlhoko tsa micro-bump le RDL routing bakeng sa liphutheloana tsa 2.5D/3D.

Moepa o otlolohileng le o otlolohileng oa mabota a mahlakoreng (85°-88°) ho matlafatsa ts'epahalo ea li-stacking tse ngata.

2. Ho tsitsisa ho feteletseng ha tikoloho

Thempereichara ea phetoho ea khalase ka holimo ho 330°C ho ikamahanya le sephutheloana sa mocheso o phahameng oa lisebelisoa tsa motlakase.

Tahlehelo e tlase ea dielectric (Df<0.005) bakeng sa maemo a phahameng-frequency millimeter-wave Tahlehelo e tlase ea dielectric (Df<0.005), e loketseng maemo a phahameng a maqhubu a millimeter-wave.

3. Khatelo-pele ea ho lumellana ha ts'ebetso

E ts'ehetsa ho pepeseha ha li-i-line/g-line dual-band, e tsamaellanang le lisebelisoa tse tloaelehileng tsa lithography tsa malapeng.

Ho nts'etsapele latitude ± 15%, ho fokotsa phello ea liphetoho tsa ts'ebetso.

4. Ts'ebetso ea lapeng ea lintlafatso tsa theknoloji

Theknoloji ea "nano-crosslinking enhancement" e ikemetse e ikemetse, e eketsa matla a mochine ka 30%.

Metsoako e se nang Halogen e se nang botsoalle ho tikoloho e tsamaellanang le litekanyetso tsa machaba tsa EHS.

Libaka tse kholo tsa kopo:

5. Teko ea netefatso ea Eco-chain

E fetisitse setifikeiti sa ts'epo ea lifeme tsa ho paka le ho etsa liteko tsa hlooho, joalo ka Changdian Technology le Tomfool Microelectronics, 'me e loketse ts'ebetso ea SMIC's 55nm BCD.